Molded Interconnect Devices (MID) Market to 2025 - Molex, MacDermid, HARTING Technology, Arlington Plating, RTP Company, Multiple Dimensions AG, TEPROSA, YOMURA

(EstateNewsWire.com, August 14, 2018 ) Molded Interconnect Devices (MID) allow amalgamation of mechanical as well as electronic components and circuits directly on 3D plastic components. MIDs combine the housing, circuit board, cables, and circuit board that comprise traditional product interfaces and integrate them into a single functional, compact part.

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MIDs offers design flexibility, which helps in space savings in a product by eliminating the need of additional components. This further helps in reducing the overall weight of the product. Further, it helps in reducing assembly times as well as the number of production steps through integration of sensors and circuits. This is anticipated to optimize the additional costs and also enable high quality components manufacturing. Such factors are anticipated to propel the market growth. However, high tooling costs as well as high prices of raw materials required for manufacturing MIDs may hinder the market.

The "Global Molded Interconnect Devices Market Analysis to 2025" is a specialized and in-depth study of the molded interconnect devices industry with a focus on the global market trend. The report aims to provide an overview of global molded interconnect devices market with detailed market segmentation by type, end-user and geography. The global molded interconnect devices market is expected to witness high growth during the forecast period. The report provides key statistics on the market status of the leading market players and offers key trends and opportunities in the market.

The report provides a detailed overview of the industry including both qualitative and quantitative information. It provides overview and forecast of the global molded interconnect devices market based on type, and end-user. It also provides market size and forecast till 2025 for overall molded interconnect devices market with respect to five major regions, namely; North America, Europe, Asia-Pacific (APAC), Middle East and Africa (MEA) and South America (SAM). The market by each region is later sub-segmented by respective countries and segments. The report covers analysis and forecast of 16 countries globally along with current trend and opportunities prevailing in the region.

Besides this, the report analyzes factors affecting market from both demand and supply side and further evaluates market dynamics effecting the market during the forecast period i.e., drivers, restraints, opportunities, and future trend. The report also provides exhaustive PEST analysis for all five regions namely; North America, Europe, APAC, MEA and South America after evaluating political, economic, social and technological factors affecting the market in these regions.

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Also, key molded interconnect devices players influencing the market are profiled in the study along with their SWOT analysis and market strategies. The report also focuses on leading industry players with information such as company profiles, products and services offered, financial information of last 3 years, key development in past five years.

Some of the major players influencing the market are TE Connectivity, LPKF Laser & Electronics AG, Molex, LLC, MacDermid, Inc., HARTING Technology Group, Arlington Plating Company, RTP Company, Multiple Dimensions AG, TEPROSA, and YOMURA among others.

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Sameer Joshi

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