Wire Bonder Equipment Market : Top Manufacturers, Market Growth Analysis, Sales, Revenue, Gross Margin & Trend For Next 5 Years

(EstateNewsWire.com, May 31, 2018 ) Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.

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Market Segment as follows:
By Type
Ball bonders
Stud-bump bonders
Wedge bonders

By Application
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)

By Company
ASM Pacific Technology
Kulicke& Soffa
Palomar Technologies
Besi
DIAS Automation
F&K Delvotec Bondtechnik
Hesse
Hybond
SHINKAWA Electric
Toray Engineering
West Bond

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Table of Contents

Part 1 Market Overview
1.1 Market Definition
1.2 Market Development
1.3 By Type
1.4 By Application
1.5 By Region

Part 2 Global Market Status and Future Forecast
2.1 Global Market by Region
2.2 Global Market by Company
2.3 Global Market by Type
2.4 Global Market by Application
2.5 Global Market by Forecast

Part 3 North America Market Status and Future Forecast
3.1 Asia Market by Region
3.2 Asia Market by Company
3.3 Asia Market by Type
3.4 Asia Market by Application
3.5 Asia Market by Forecast

Part 4 United States Market Status and Future Forecast
4.1 United States Market by Type
4.2 United States Market by Application
4.3 United States Market by Forecast

Part 5 Canada Market Status and Future Forecast
5.1 Canada Market by Type
5.2 Canada Market by Application
5.3 Canada Market by Forecast

Part 6 Mexico Market Status and Future Forecast
6.1 Mexico Market by Type
6.2 Mexico Market by Application
6.3 Mexico Market by Forecast

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